{"id":40112,"date":"2026-02-12T21:08:25","date_gmt":"2026-02-12T21:08:25","guid":{"rendered":"https:\/\/www.globalresearch.co.kr\/insight\/high-density-packaging-market-mordor\/"},"modified":"2026-03-27T23:18:38","modified_gmt":"2026-03-27T14:18:38","slug":"high-density-packaging-market-mordor","status":"publish","type":"post","link":"https:\/\/www.globalresearch.co.kr\/insight\/high-density-packaging-market-mordor\/","title":{"rendered":"\uc138\uacc4\uc758 \uace0\ubc00\ub3c4 \ud328\ud0a4\uc9d5 \uc2dc\uc7a5 \uaddc\ubaa8 \ubc0f \uc810\uc720\uc728 \ubd84\uc11d &#8211; \uc131\uc7a5 \ub3d9\ud5a5 \ubc0f \uc804\ub9dd (2025\ub144 &#8211; 2030\ub144)"},"content":{"rendered":"<p><img decoding=\"async\" src=\"https:\/\/www.globalresearch.co.kr\/insight\/wp-content\/uploads\/2026\/02\/high-density-packaging-market.png\" alt=\"Chart\" class=\"aligncenter size-full\" \/><\/p>\n<p><img decoding=\"async\" src=\"https:\/\/www.globalresearch.co.kr\/insight\/wp-content\/uploads\/2026\/02\/high-density-packaging-market-size-image-1735458827423.webp\" alt=\"Chart\" class=\"aligncenter size-full\" \/><\/p>\n<p class=\"toc-level-1 toc-content-heading\" id=\"toc-content-heading-0\">1. \uc11c\ub860<\/p>\n<ul>\n<li class=\"toc-level-2\">1.1 \uc5f0\uad6c \uc131\uacfc\ubb3c<\/li>\n<li class=\"toc-level-2\">1.2 \uc5f0\uad6c \uac00\uc815<\/li>\n<li class=\"toc-level-2\">1.3 \uc5f0\uad6c \ubc94\uc704<\/li>\n<\/ul>\n<p class=\"toc-level-1 toc-content-heading\" id=\"toc-content-heading-1\">2. \uc5f0\uad6c \ubc29\ubc95\ub860<\/p>\n<p class=\"toc-level-1 toc-content-heading\" id=\"toc-content-heading-2\">3. \uc694\uc57d<\/p>\n<p class=\"toc-level-1 toc-content-heading\" id=\"toc-content-heading-3\">4. \uc2dc\uc7a5 \uc5ed\ud559<\/p>\n<ul>\n<li class=\"toc-level-2\">4.1 \uc2dc\uc7a5 \uac1c\uc694<\/li>\n<li class=\"toc-level-2\">4.2 \uc2dc\uc7a5 \ub3d9\uc778 \ubc0f \uc81c\uc57d \uc694\uc778 \uc18c\uac1c<\/li>\n<li class=\"toc-level-2\">4.3 \uc2dc\uc7a5 \ub3d9\uc778\n<ul>\n<li class=\"toc-level-3\">4.3.1 \uc18c\ube44\uc790 \uc804\uc790 \uc81c\ud488\uc758 \ubc1c\uc804 \uc99d\uac00<\/li>\n<li class=\"toc-level-3\">4.3.2 \uac1c\ubc1c\ub3c4\uc0c1\uad6d\uc758 \uc6b0\ud638\uc801\uc778 \uc815\ubd80 \uc815\ucc45 \ubc0f \uaddc\uc81c<\/li>\n<\/ul>\n<\/li>\n<li class=\"toc-level-2\">4.4 \uc2dc\uc7a5 \uc81c\uc57d \uc694\uc778\n<ul>\n<li class=\"toc-level-3\">4.4.1 \ub192\uc740 \ucd08\uae30 \ud22c\uc790 \ube44\uc6a9 \ubc0f IC \uc124\uacc4\uc758 \ubcf5\uc7a1\uc131 \uc99d\uac00<\/li>\n<\/ul>\n<\/li>\n<li class=\"toc-level-2\">4.5 \uac00\uce58 \uc0ac\uc2ac \/ \uacf5\uae09 \uc0ac\uc2ac \ubd84\uc11d<\/li>\n<li class=\"toc-level-2\">4.6 \uc0b0\uc5c5 \ub9e4\ub825\ub3c4 &#8211; \ud3ec\ud130\uc758 5\uac00\uc9c0 \uacbd\uc7c1 \uc694\uc778 \ubd84\uc11d\n<ul>\n<li class=\"toc-level-3\">4.6.1 \uc2e0\uaddc \uc9c4\uc785\uc790\uc758 \uc704\ud611<\/li>\n<li class=\"toc-level-3\">4.6.2 \uad6c\ub9e4\uc790\/\uc18c\ube44\uc790\uc758 \uad50\uc12d\ub825<\/li>\n<li class=\"toc-level-3\">4.6.3 \uacf5\uae09\uc5c5\uccb4\uc758 \uad50\uc12d\ub825<\/li>\n<li class=\"toc-level-3\">4.6.4 \ub300\uccb4 \uc81c\ud488\uc758 \uc704\ud611<\/li>\n<li class=\"toc-level-3\">4.6.5 \uacbd\uc7c1 \uac15\ub3c4<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n<p class=\"toc-level-1 toc-content-heading\" id=\"toc-content-heading-4\">5. \uc2dc\uc7a5 \uc138\ubd84\ud654<\/p>\n<ul>\n<li class=\"toc-level-2\">5.1 \ud3ec\uc7a5 \uae30\uc220\ubcc4\n<ul>\n<li class=\"toc-level-3\">5.1.1 MCM<\/li>\n<li class=\"toc-level-3\">5.1.2 MCP<\/li>\n<li class=\"toc-level-3\">5.1.3 SIP<\/li>\n<li class=\"toc-level-3\">5.1.4 3D &#8211; TSV<\/li>\n<\/ul>\n<\/li>\n<li class=\"toc-level-2\">5.2 \uc560\ud50c\ub9ac\ucf00\uc774\uc158\ubcc4\n<ul>\n<li class=\"toc-level-3\">5.2.1 \uc18c\ube44\uc790 \uc804\uc790\uc81c\ud488<\/li>\n<li class=\"toc-level-3\">5.2.2 \ud56d\uacf5\uc6b0\uc8fc \ubc0f \ubc29\uc704<\/li>\n<li class=\"toc-level-3\">5.2.3 \uc758\ub8cc \uae30\uae30<\/li>\n<li class=\"toc-level-3\">5.2.4 IT \ubc0f \ud1b5\uc2e0<\/li>\n<li class=\"toc-level-3\">5.2.5 \uc790\ub3d9\ucc28<\/li>\n<li class=\"toc-level-3\">5.2.6 \uae30\ud0c0 \uc560\ud50c\ub9ac\ucf00\uc774\uc158<\/li>\n<\/ul>\n<\/li>\n<li class=\"toc-level-2\">5.3 \uc9c0\uc5ed\ubcc4\n<ul>\n<li class=\"toc-level-3\">5.3.1 \ubd81\ubbf8<\/li>\n<li class=\"toc-level-3\">5.3.2 \uc720\ub7fd<\/li>\n<li class=\"toc-level-3\">5.3.3 \uc544\uc2dc\uc544 \ud0dc\ud3c9\uc591<\/li>\n<li class=\"toc-level-3\">5.3.4 \ub77c\ud2f4 \uc544\uba54\ub9ac\uce74<\/li>\n<li class=\"toc-level-3\">5.3.5 \uc911\ub3d9 \ubc0f \uc544\ud504\ub9ac\uce74<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n<p class=\"toc-level-1 toc-content-heading\" id=\"toc-content-heading-5\">6. \uacbd\uc7c1 \ud658\uacbd<\/p>\n<ul>\n<li class=\"toc-level-2\">6.1 \uae30\uc5c5 \ud504\ub85c\ud544\n<ul>\n<li class=\"toc-level-3\">6.1.1 Toshiba Corporation<\/li>\n<li class=\"toc-level-3\">6.1.2 IBM Corporation<\/li>\n<li class=\"toc-level-3\">6.1.3 Amkor Technology<\/li>\n<li class=\"toc-level-3\">6.1.4 Fujitsu Ltd.<\/li>\n<li class=\"toc-level-3\">6.1.5 Siliconware Precision Industries<\/li>\n<li class=\"toc-level-3\">6.1.6 Hitachi, Ltd.<\/li>\n<li class=\"toc-level-3\">6.1.7 Samsung Group<\/li>\n<li class=\"toc-level-3\">6.1.8 Micron Technology<\/li>\n<li class=\"toc-level-3\">6.1.9 STMicroelectronics<\/li>\n<li class=\"toc-level-3\">6.1.10 NXP Semiconductors N.V.<\/li>\n<li class=\"toc-level-3\">6.1.11 Mentor &#8211; a Siemens Business<\/li>\n<\/ul>\n<\/li>\n<li><strong>*\ubaa9\ub85d\uc740 \uc804\uccb4\uac00 \uc544\ub2d8<\/strong><\/li>\n<\/ul>\n<p class=\"toc-level-1 toc-content-heading\" id=\"toc-content-heading-6\">7. \ud22c\uc790 \ubd84\uc11d<\/p>\n<p class=\"toc-level-1 toc-content-heading\" id=\"toc-content-heading-7\">8. \uc2dc\uc7a5 \uae30\ud68c \ubc0f \ubbf8\ub798 \ub3d9\ud5a5<\/p>\n<div style=\"font-family:regular_semibold\">\uc774\uc6a9 \uac00\ub2a5 \uc5ec\ubd80\uc5d0 \ub530\ub984<\/div><\/p>\n","protected":false},"excerpt":{"rendered":"<p>\uace0\ubc00\ub3c4 \ud328\ud0a4\uc9d5 \uc2dc\uc7a5 \uaddc\ubaa8 \ubc0f \uc810\uc720\uc728 \ubd84\uc11d &#8211; \uc131\uc7a5 \ub3d9\ud5a5 \ubc0f \uc608\uce21 (2025-2030)<\/p>\n<p># 1. \uc2dc\uc7a5 \uac1c\uc694 \ubc0f \uc804\ub9dd<\/p>\n<p>\uace0\ubc00\ub3c4 \ud328\ud0a4\uc9d5(High Density Packaging, HDP) \uc2dc\uc7a5\uc740 \uc608\uce21 \uae30\uac04(2025-2030\ub144) \ub3d9\uc548 \uc5f0\ud3c9\uade0 \uc131\uc7a5\ub960(CAGR) 12.00%\ub97c \uae30\ub85d\ud558\uba70 \uacac\uc870\ud55c \uc131\uc7a5\uc744 \ubcf4\uc77c \uac83\uc73c\ub85c \uc608\uc0c1\ub429\ub2c8\ub2e4. \uc774 \uc2dc\uc7a5\uc740 MCM(Multi-Chip Module), MCP(Multi-Chip Package), SIP(System-in-Package), 3D-TSV(3D Through-Silicon Via)\uc640 \uac19\uc740 \ub2e4\uc591\ud55c \ud328\ud0a4\uc9d5 \uae30\uc220\uacfc \uac00\uc804\uc81c\ud488, \ud56d\uacf5\uc6b0\uc8fc \ubc0f \ubc29\uc704, \uc758\ub8cc \uae30\uae30, IT \ubc0f \ud1b5\uc2e0, \uc790\ub3d9\ucc28, \uc5d0\ub108\uc9c0 \ubc0f \uc720\ud2f8\ub9ac\ud2f0 \ub4f1 \uad11\ubc94\uc704\ud55c \uc560\ud50c\ub9ac\ucf00\uc774\uc158 \ubd84\uc57c\ub85c \uc138\ubd84\ud654\ub429\ub2c8\ub2e4.<\/p>\n<p>HDP \uc2dc\uc7a5\uc740 \ud22c\uc790 \ucee4\ubba4\ub2c8\ud2f0\uc5d0\uc11c \ud070 \uc8fc\ubaa9\uc744 \ubc1b\uace0 \uc788\uc73c\uba70, \ucd5c\uc2e0 \uae30\uc220\uc5d0 \ub300\ud55c \uc18c\ube44\uc790 \uc120\ud638\ub3c4\uc758 \ubcc0\ud654\uc640 \uc804\uc790 \uae30\uae30 \ubd84\uc57c \uc8fc\uc694 \uae30\uc5c5\ub4e4\uc758 \ub04a\uc784\uc5c6\ub294 \ud601\uc2e0\uc774 \uc2dc\uc7a5 \uc218\uc694\ub97c \ud06c\uac8c \uacac\uc778\ud558\uace0 \uc788\uc2b5\ub2c8\ub2e4. \ud2b9\ud788, \ub300\ubd80\ubd84\uc758 \uc778\uad6c\uac00 \ucee4\ub125\ud2f0\ub4dc \uae30\uae30\ub85c \uc804\ud658\ud568\uc5d0 \ub530\ub77c \uc0ac\ubb3c \uc778\ud130\ub137(IoT)\uc758 \uc99d\uac00\ub294 \uace0\ubc00\ub3c4 \ud328\ud0a4\uc9d5 \uc2dc\uc7a5\uc758 \uc131\uc7a5\uc744 \ucd09\uc9c4\ud560 \uac83\uc785\ub2c8\ub2e4. \uc6e8\uc5b4\ub7ec\ube14 \uae30\uae30, \uc2a4\ub9c8\ud2b8\ud3f0, \uc2a4\ub9c8\ud2b8 \uac00\uc804\uc81c\ud488 \ub4f1 \uc18c\ube44\uc790 \uc804\uc790\uc81c\ud488\uc5d0 \ub300\ud55c \uc218\uc694 \uc99d\uac00\ub294 \uc774 \uc0b0\uc5c5\uc5d0 \uae0d\uc815\uc801\uc778 \uc601\ud5a5\uc744 \ubbf8\uce60 \uac83\uc73c\ub85c \uc804\ub9dd\ub429\ub2c8\ub2e4. \uc608\ub97c \ub4e4\uc5b4, Amkor\ub294 \uc790\ub3d9\ucc28, \uc2a4\ud0dd \ub2e4\uc774, MEMS, TSV, 3D \ud328\ud0a4\uc9d5 \ub4f1 \uace0\ubc00\ub3c4 \ud328\ud0a4\uc9d5 \uc560\ud50c\ub9ac\ucf00\uc774\uc158\uc744 \ud3ec\ud568\ud558\uc5ec 3,000\uac00\uc9c0 \uc774\uc0c1\uc758 \ud328\ud0a4\uc9d5 \uc194\ub8e8\uc158\uc744 \uc81c\uacf5\ud558\uace0 \uc788\uc2b5\ub2c8\ub2e4. \uac1c\ubc1c\ub3c4\uc0c1\uad6d\uc758 \uc6b0\ud638\uc801\uc778 \uc815\ubd80 \uaddc\uc81c \ub610\ud55c \uc608\uce21 \uae30\uac04 \ub3d9\uc548 \uc2dc\uc7a5 \uc131\uc7a5\uc744 \uc8fc\ub3c4\ud560 \uac83\uc73c\ub85c \ubcf4\uc774\ub098, \ub192\uc740 \ucd08\uae30 \ud22c\uc790 \ube44\uc6a9\uc740 \uc2dc\uc7a5 \uc131\uc7a5\uc744 \uc800\ud574\ud558\ub294 \uc694\uc778\uc774 \ub420 \uc218 \uc788\uc2b5\ub2c8\ub2e4.<\/p>\n<p># 2. \uc2dc\uc7a5 \uc2a4\ub0c5\uc0f7 (2019-2030)<\/p>\n<p>*   \uc870\uc0ac \uae30\uac04: 2019\ub144 &#8211; 2030\ub144<br \/>\n*   \uc608\uce21 \ub370\uc774\ud130 \uae30\uac04: 2025\ub144 &#8211; 2030\ub144<br \/>\n*   \uacfc\uac70 \ub370\uc774\ud130 \uae30\uac04: 2019\ub144 &#8211; 2023\ub144<br \/>\n*   \uc5f0\ud3c9\uade0 \uc131\uc7a5\ub960 (CAGR): 12.00%<br \/>\n*   \uac00\uc7a5 \ube60\ub974\uac8c \uc131\uc7a5\ud558\ub294 \uc2dc\uc7a5: \uc544\uc2dc\uc544 \ud0dc\ud3c9\uc591<br \/>\n*   \uac00\uc7a5 \ud070 \uc2dc\uc7a5: \ubd81\ubbf8<br \/>\n*   \uc2dc\uc7a5 \uc9d1\uc911\ub3c4: \ub0ae\uc74c (\ubd84\uc0b0\ub41c \uc2dc\uc7a5)<br \/>\n*   \uc8fc\uc694 \uae30\uc5c5: Toshiba Corporation, Fujitsu Ltd., Hitachi, Ltd., IBM Corporation, SPIL, Micro Technology, Amkor Technology, Mentor &#8211; a Siemens Business \ub4f1 (\uc21c\uc11c \ubb34\uad00)<\/p>\n<p># 3. \uc8fc\uc694 \uc2dc\uc7a5 \ub3d9\ud5a5 \ubc0f \ud1b5\ucc30<\/p>\n<p> 3.1. \uac00\uc804\uc81c\ud488 \ubd80\ubb38\uc758 \ub192\uc740 \uc801\uc6a9\uc774 \uc2dc\uc7a5 \uc131\uc7a5\uc744 \ucd09\uc9c4<\/p>\n<p>\uc804\uc790\uc81c\ud488 \uc2dc\uc7a5\uc740 \uc9c0\uc18d\uc801\uc73c\ub85c \ub354 \ub192\uc740 \uc804\ub825 \uc18c\ubaa8, \ub354 \ube60\ub978 \uc18d\ub3c4, \ub354 \ub9ce\uc740 \ud540 \uc218, \uadf8\ub9ac\uace0 \ub354 \uc791\uc740 \ud48b\ud504\ub9b0\ud2b8\uc640 \ub0ae\uc740 \ud504\ub85c\ud30c\uc77c\uc744 \uc694\uad6c\ud558\uace0 \uc788\uc2b5\ub2c8\ub2e4. \uace0\ubc00\ub3c4 \ubc18\ub3c4\uccb4 \ud328\ud0a4\uc9d5\uc758 \uc18c\ud615\ud654 \ubc0f \ud1b5\ud569\uc740 \ud0dc\ube14\ub9bf, \uc2a4\ub9c8\ud2b8\ud3f0, \uadf8\ub9ac\uace0 \uc0c8\ub86d\uac8c \ubd80\uc0c1\ud558\ub294 IoT \uae30\uae30\uc640 \uac19\uc740 \ub354 \uc791\uace0, \uac00\ubccd\uace0, \ud734\ub300\ud558\uae30 \ud3b8\ub9ac\ud55c \uae30\uae30\uc758 \ub4f1\uc7a5\uc744 \uac00\ub2a5\ud558\uac8c \ud588\uc2b5\ub2c8\ub2e4.<\/p>\n<p>\ubc18\ub3c4\uccb4 \uc0b0\uc5c5 \ud611\ud68c(Semiconductor Industry Association)\uc5d0 \ub530\ub974\uba74, 2018\ub144 \uc804 \uc138\uacc4 \ubc18\ub3c4\uccb4 \ub9e4\ucd9c\uc740 13.7% \uc99d\uac00\ud558\uc5ec 4,680\uc5b5 \ub2ec\ub7ec\ub97c \uae30\ub85d\ud588\uc73c\uba70, \ucd9c\ud558\ub7c9\uc740 1\uc870 \uac1c\uc5d0 \ub2ec\ud588\uc2b5\ub2c8\ub2e4. \uadf8\ub7ec\ub098 \uc138\uacc4 \ubc18\ub3c4\uccb4 \ubb34\uc5ed \ud1b5\uacc4(World Semiconductor Trade Statistics)\uc5d0 \ub530\ub974\uba74, 2019\ub144\uc5d0\ub294 IC \uac00\uaca9 \uc57d\uc138\ub85c \uc778\ud574 \uc218\uc694\uac00 \uac10\uc18c\ud588\uc9c0\ub9cc, 2020\ub144\ubd80\ud130\ub294 \uc18c\ube44\uc790 \uc804\uc790\uc81c\ud488 \uc218\uc694 \uc99d\uac00\ub85c \uc778\ud574 \ub2e4\uc2dc \uc99d\uac00\ud560 \uac83\uc73c\ub85c \uc608\uc0c1\ub429\ub2c8\ub2e4. \uc608\ub97c \ub4e4\uc5b4, \ubbf8\uad6d\uc740 \uc2a4\ub9c8\ud2b8\ud3f0 \ud310\ub9e4\uc5d0\uc11c \uafb8\uc900\ud55c \uc131\uc7a5\uc744 \ubcf4\uc600\uc73c\uba70, \uc774\ub7ec\ud55c \ucd94\uc138\ub294 \uc608\uce21 \uae30\uac04 \ub3d9\uc548 \ub2e4\ub978 \uc9c0\uc5ed\uc758 \uace0\ubc00\ub3c4 \ud328\ud0a4\uc9d5 \uc2dc\uc7a5\uc744 \uacac\uc778\ud560 \uac83\uc73c\ub85c \uc804\ub9dd\ub429\ub2c8\ub2e4.<\/p>\n<p> 3.2. \uc544\uc2dc\uc544 \ud0dc\ud3c9\uc591 \uc9c0\uc5ed\uc758 \uac00\uc7a5 \ub192\uc740 \uc131\uc7a5\ub960<\/p>\n<p>\uc544\uc2dc\uc544 \ud0dc\ud3c9\uc591 \uc9c0\uc5ed\uc740 \uc608\uce21 \uae30\uac04 \ub3d9\uc548 \uc8fc\uc694 \uc218\uc775 \ucc3d\ucd9c \uc9c0\uc5ed\uc73c\ub85c\uc11c \uac00\uc7a5 \ub192\uc740 \uc131\uc7a5\ub960\uc744 \ubcf4\uc77c \uac83\uc73c\ub85c \uc608\uc0c1\ub429\ub2c8\ub2e4. \uc774\ub294 \ubc29\ub300\ud55c \uc778\uad6c\uc640 \uc18c\ube44\uc790 \uce21\uba74\uc758 \uc218\uc694 \uc99d\uac00\uc5d0 \uc8fc\ub85c \uae30\uc778\ud569\ub2c8\ub2e4. \ub610\ud55c, \uc774 \uc9c0\uc5ed\uc5d0 \uc9c4\ucd9c\ud574 \uc788\ub294 \uc720\uc218\uc758 \uace0\ubc00\ub3c4 \ud328\ud0a4\uc9d5 \uae30\uc5c5\ub4e4\uc774 \uc2dc\uc7a5 \uc218\uc694\ub97c \ucd09\uc9c4\ud558\uace0 \uc788\uc2b5\ub2c8\ub2e4.<\/p>\n<p>\ud2b9\ud788 \uc911\uad6d\uc740 \uac70\ub300\ud55c \uc778\uad6c\ub97c \uac00\uc9c4 \uac00\uc7a5 \ube60\ub974\uac8c \uc131\uc7a5\ud558\ub294 \uacbd\uc81c\uad6d\uc774\uba70, \uc911\uad6d \ubc18\ub3c4\uccb4 \ud611\ud68c(China\u2019s Semiconductor Association) \ud1b5\uacc4\uc5d0 \ub530\ub974\uba74 2014\ub144\ubd80\ud130 IC \uc218\uc785\uc774 \uc9c0\uc18d\uc801\uc73c\ub85c \uc99d\uac00\ud558\uace0 \uc788\uc2b5\ub2c8\ub2e4. \ub098\uc544\uac00 \uc911\uad6d \uc815\ubd80\ub294 2030\ub144\uae4c\uc9c0 \ubaa8\ub4e0 \uc8fc\uc694 IC \uc0b0\uc5c5 \uacf5\uae09\ub9dd \ubd80\ubb38\uc5d0\uc11c \uae00\ub85c\ubc8c \ub9ac\ub354\uac00 \ub418\uaca0\ub2e4\ub294 \ubaa9\ud45c\ub97c \ub2ec\uc131\ud558\uae30 \uc704\ud574 \uad6d\ub0b4 IC \uc0b0\uc5c5 \ubc1c\uc804\uc744 \uc9c0\uc6d0\ud558\ub294 \ub2e4\uac01\uc801\uc778 \uc804\ub7b5\uc744 \ucd94\uc9c4\ud558\uace0 \uc788\uc2b5\ub2c8\ub2e4. \uc774\ub7ec\ud55c \uc9c0\uc5ed \ub0b4 \ubc18\ub3c4\uccb4 IC \uc0b0\uc5c5\uc758 \uc131\uc7a5\uc740 \uace0\ubc00\ub3c4 \ud328\ud0a4\uc9d5 \uc218\uc694\ub97c \uc790\uadf9\ud560 \uac83\uc73c\ub85c \uae30\ub300\ub429\ub2c8\ub2e4.<\/p>\n<p># 4. \uacbd\uc7c1 \ud658\uacbd<\/p>\n<p>\uace0\ubc00\ub3c4 \ud328\ud0a4\uc9d5 \uc2dc\uc7a5\uc740 Toshiba Corporation, Fujitsu Ltd., Hitachi, Ltd., IBM Corporation, SPIL, Micro Technology, Amkor Technology, Mentor &#8211; a Siemens Business \ub4f1 \ub2e4\uc218\uc758 \uc8fc\uc694 \uae30\uc5c5\ub4e4\uc774 \uc874\uc7ac\ud558\uc5ec \uc2dc\uc7a5 \uc9d1\uc911\ub3c4\uac00 \ub0ae\uc740(fragmented) \ud2b9\uc9d5\uc744 \ubcf4\uc774\uba70, \ud2b9\uc815 \uc9c0\ubc30\uc801\uc778 \ud50c\ub808\uc774\uc5b4\uac00 \uc5c6\ub294 \uc0c1\ud669\uc785\ub2c8\ub2e4.<\/p>\n<p>\ucd5c\uadfc \uc2dc\uc7a5\uc758 \uc8fc\uc694 \ub3d9\ud5a5\uc73c\ub85c\ub294 \ub2e4\uc74c\uacfc \uac19\uc740 \uae30\uc5c5 \ud65c\ub3d9\uc774 \uc788\uc2b5\ub2c8\ub2e4:<\/p>\n<p>*   2019\ub144 1\uc6d4: Red Hat \uc8fc\uc8fc\ub4e4\uc740 IBM\uacfc\uc758 \ud569\ubcd1\uc744 \uc2b9\uc778\ud588\uc2b5\ub2c8\ub2e4. \uc774 \uac70\ub798\ub294 \uaddc\uc81c \uac80\ud1a0\ub97c \ud3ec\ud568\ud55c \ud1b5\uc0c1\uc801\uc778 \ub9c8\uac10 \uc870\uac74\uc5d0 \ub530\ub77c 2019\ub144 \ud558\ubc18\uae30\uc5d0 \uc644\ub8cc\ub420 \uac83\uc73c\ub85c \uc608\uc0c1\ub418\uc5c8\uc2b5\ub2c8\ub2e4. IBM\uc740 Red Hat\uc758 \ubaa8\ub4e0 \ubc1c\ud589 \uc8fc\uc2dd\uc744 \uc778\uc218\ud560 \uc758\uc0ac\ub97c \ubc1c\ud45c\ud588\uc73c\uba70, Red Hat\uc758 \ubc29\ub300\ud55c \uc624\ud508 \uc18c\uc2a4 \uae30\uc220 \ud3ec\ud2b8\ud3f4\ub9ac\uc624, \ud601\uc2e0\uc801\uc778 \ud074\ub77c\uc6b0\ub4dc \uac1c\ubc1c \ud50c\ub7ab\ud3fc \ubc0f \uac1c\ubc1c\uc790 \ucee4\ubba4\ub2c8\ud2f0\uac00 IBM\uc758 \ud601\uc2e0\uc801\uc778 \ud558\uc774\ube0c\ub9ac\ub4dc \ud074\ub77c\uc6b0\ub4dc \uae30\uc220, \uc0b0\uc5c5 \uc804\ubb38\uc131, \ub370\uc774\ud130, \uc2e0\ub8b0 \ubc0f \ubcf4\uc548\uc5d0 \ub300\ud55c \uc57d\uc18d\uacfc \uacb0\ud569\ub418\uc5b4 \ud074\ub77c\uc6b0\ub4dc \uad6c\ud604\uc758 \ub2e4\uc74c \uc7a5\uc5d0 \ud544\uc694\ud55c \ud558\uc774\ube0c\ub9ac\ub4dc \ud074\ub77c\uc6b0\ub4dc \uc5ed\ub7c9\uc744 \uc81c\uacf5\ud560 \uac83\uc73c\ub85c \uae30\ub300\ub429\ub2c8\ub2e4.<br \/>\n*   2018\ub144 7\uc6d4: \uc544\uc6c3\uc18c\uc2f1 \ubc18\ub3c4\uccb4 \ud328\ud0a4\uc9d5 \uc11c\ube44\uc2a4\uc758 \uc120\ub3c4\uc801\uc778 \uacf5\uae09\uc5c5\uccb4\uc778 Amkor Technology, Inc.\ub294 Mentor\uc640\uc758 \ud30c\ud2b8\ub108\uc2ed\uc744 \ud1b5\ud574 \uc5c5\uacc4 \ucd5c\ucd08\ub85c Mentor\uc758 \uace0\ubc00\ub3c4 \ud328\ud0a4\uc9d5 \uc124\uacc4 \ubc29\ubc95 \ubc0f \ub3c4\uad6c\ub97c \uc9c0\uc6d0\ud558\ub294 Amkor\uc758 SmartPackage Package Assembly Design Kit\ub97c \ucd9c\uc2dc\ud588\ub2e4\uace0 \ubc1c\ud45c\ud588\uc2b5\ub2c8\ub2e4. \uc774 \ud0a4\ud2b8\ub294 Mentor\uc758 \uc18c\ud504\ud2b8\uc6e8\uc5b4\uc640 \uc5f0\uacc4\ud558\uc5ec \uc0ac\ubb3c \uc778\ud130\ub137, \uc790\ub3d9\ucc28, \uc778\uacf5\uc9c0\ub2a5 \uc560\ud50c\ub9ac\ucf00\uc774\uc158\uc5d0 \ud544\uc694\ud55c \uace0\uae09 \ud328\ud0a4\uc9c0\uc758 \uc2e0\uc18d\ud558\uace0 \uc0c1\uc138\ud55c \uac80\uc99d \uacb0\uacfc\ub97c \uc81c\uacf5\ud560 \uc218 \uc788\uac8c \ub418\uc5c8\uc2b5\ub2c8\ub2e4.<\/p>\n<p>\uc774\ub7ec\ud55c \uae30\uc5c5\ub4e4\uc758 \uc804\ub7b5\uc801 \uc6c0\uc9c1\uc784\uc740 \uace0\ubc00\ub3c4 \ud328\ud0a4\uc9d5 \uae30\uc220\uc774 \ud074\ub77c\uc6b0\ub4dc \ucef4\ud4e8\ud305, IoT, AI, \uc790\ub3d9\ucc28 \ub4f1 \ucca8\ub2e8 \uae30\uc220 \ubd84\uc57c\uc5d0\uc11c \ud575\uc2ec\uc801\uc778 \uc5ed\ud560\uc744 \ud558\uace0 \uc788\uc74c\uc744 \ubcf4\uc5ec\uc90d\ub2c8\ub2e4.<\/p>\n<p>&#8220;\uae00\ub85c\ubc8c \uace0\ubc00\ub3c4 \ud328\ud0a4\uc9d5 \uc2dc\uc7a5 \ubcf4\uace0\uc11c&#8221;\ub294 MCM(Multi-Chip Module), MCP(Multi-Chip Package), SIP(System-in-Package), 3D-TSV(Through-Silicon Via) \ub4f1 \ub2e4\uc591\ud55c \uace0\ubc00\ub3c4 \ud328\ud0a4\uc9d5 \uae30\uc220\uc744 \ud65c\uc6a9\ud558\uc5ec \ubcf5\uc7a1\ud55c \uc9d1\uc801\ud68c\ub85c(IC) \uce69\uc744 \ubc30\uc5f4\ud558\ub294 \ucca8\ub2e8 \ud328\ud0a4\uc9d5 \uc2dc\uc7a5\uc5d0 \ub300\ud55c \uc2ec\uce35 \ubd84\uc11d\uc744 \uc81c\uacf5\ud569\ub2c8\ub2e4. \uc8fc\uc694 \uc751\uc6a9 \ubd84\uc57c\ub85c\ub294 \uac00\uc804\uc81c\ud488, IT \ubc0f \ud1b5\uc2e0, \uc790\ub3d9\ucc28, \uc758\ub8cc \uae30\uae30 \ub4f1\uc774 \uc788\uc2b5\ub2c8\ub2e4.<\/p>\n<p>\ubcf8 \ubcf4\uace0\uc11c\ub294 \uc5f0\uad6c \ubc29\ubc95\ub860, \uc8fc\uc694 \uc694\uc57d, \uc2dc\uc7a5 \uc5ed\ud559, \uc2dc\uc7a5 \uc138\ubd84\ud654, \uacbd\uc7c1 \ud658\uacbd, \ud22c\uc790 \ubd84\uc11d, \uc2dc\uc7a5 \uae30\ud68c \ubc0f \ubbf8\ub798 \ub3d9\ud5a5 \ub4f1 \ud3ec\uad04\uc801\uc778 \ub0b4\uc6a9\uc744 \ub2e4\ub8f9\ub2c8\ub2e4.<\/p>\n<p>\uc2dc\uc7a5 \uc5ed\ud559 \ubd84\uc11d:<br \/>\n\uc2dc\uc7a5 \uc131\uc7a5\uc744 \uacac\uc778\ud558\ub294 \uc8fc\uc694 \ub3d9\uc778\uc73c\ub85c\ub294 \uc18c\ube44\uc790 \uc804\uc790 \uc81c\ud488\uc758 \uc9c0\uc18d\uc801\uc778 \ubc1c\uc804\uacfc \uac1c\ubc1c\ub3c4\uc0c1\uad6d\uc758 \uc6b0\ud638\uc801\uc778 \uc815\ubd80 \uc815\ucc45 \ubc0f \uaddc\uc81c\uac00 \uc5b8\uae09\ub429\ub2c8\ub2e4. \ubc18\uba74, \ub192\uc740 \ucd08\uae30 \ud22c\uc790 \ube44\uc6a9\uacfc IC \uc124\uacc4\uc758 \ubcf5\uc7a1\uc131 \uc99d\uac00\ub294 \uc2dc\uc7a5 \uc131\uc7a5\uc744 \uc800\ud574\ud558\ub294 \uc8fc\uc694 \uc694\uc778\uc73c\ub85c \uc791\uc6a9\ud569\ub2c8\ub2e4. \ub610\ud55c, \uac00\uce58 \uc0ac\uc2ac\/\uacf5\uae09\ub9dd \ubd84\uc11d\uacfc \uc2e0\uaddc \uc9c4\uc785\uc790\uc758 \uc704\ud611, \uad6c\ub9e4\uc790\/\uc18c\ube44\uc790\uc758 \uad50\uc12d\ub825, \uacf5\uae09\uc5c5\uccb4\uc758 \uad50\uc12d\ub825, \ub300\uccb4 \uc81c\ud488\uc758 \uc704\ud611, \uacbd\uc7c1 \uac15\ub3c4 \ub4f1\uc744 \ud3c9\uac00\ud558\ub294 Porter\uc758 5\uac00\uc9c0 \uacbd\uc7c1 \uc694\uc778 \ubd84\uc11d\uc744 \ud1b5\ud574 \uc0b0\uc5c5\uc758 \ub9e4\ub825\ub3c4\ub97c \uc2ec\uce35\uc801\uc73c\ub85c \ubd84\uc11d\ud569\ub2c8\ub2e4.<\/p>\n<p>\uc2dc\uc7a5 \uc138\ubd84\ud654:<br \/>\n\uc2dc\uc7a5\uc740 \uc138 \uac00\uc9c0 \uc8fc\uc694 \uae30\uc900\uc73c\ub85c \uc138\ubd84\ud654\ub429\ub2c8\ub2e4.<br \/>\n1.  \ud328\ud0a4\uc9d5 \uae30\uc220\ubcc4: MCM, MCP, SIP, 3D-TSV.<br \/>\n2.  \uc751\uc6a9 \ubd84\uc57c\ubcc4: \uac00\uc804\uc81c\ud488, \ud56d\uacf5\uc6b0\uc8fc \ubc0f \ubc29\uc704, \uc758\ub8cc \uae30\uae30, IT \ubc0f \ud1b5\uc2e0, \uc790\ub3d9\ucc28, \uae30\ud0c0 \uc751\uc6a9 \ubd84\uc57c.<br \/>\n3.  \uc9c0\uc5ed\ubcc4: \ubd81\ubbf8, \uc720\ub7fd, \uc544\uc2dc\uc544 \ud0dc\ud3c9\uc591, \uc911\ub0a8\ubbf8, \uc911\ub3d9 \ubc0f \uc544\ud504\ub9ac\uce74.<\/p>\n<p>\uacbd\uc7c1 \ud658\uacbd:<br \/>\n\ubcf4\uace0\uc11c\ub294 Toshiba Corporation, IBM Corporation, Amkor Technology, Fujitsu Ltd., Siliconware Precision Industries, Hitachi, Ltd., Samsung Group, Micron Technology, STMicroelectronics, NXP Semiconductors N.V., Mentor &#8211; a Siemens Business \ub4f1 \uc8fc\uc694 \uc2dc\uc7a5 \ucc38\uc5ec \uae30\uc5c5\ub4e4\uc758 \ud504\ub85c\ud544\uc744 \uc0c1\uc138\ud788 \ub2e4\ub8e8\uba70, \uacbd\uc7c1 \uad6c\ub3c4\ub97c \uba85\ud655\ud788 \uc81c\uc2dc\ud569\ub2c8\ub2e4.<\/p>\n<p>\uc8fc\uc694 \uc2dc\uc7a5 \ud1b5\ucc30 \ubc0f \uc608\uce21:<br \/>\n\uace0\ubc00\ub3c4 \ud328\ud0a4\uc9d5 \uc2dc\uc7a5\uc740 \uc608\uce21 \uae30\uac04(2025-2030\ub144) \ub3d9\uc548 \uc5f0\ud3c9\uade0 \uc131\uc7a5\ub960(CAGR) 12%\ub97c \uae30\ub85d\ud558\uba70 \uc131\uc7a5\ud560 \uac83\uc73c\ub85c \uc804\ub9dd\ub429\ub2c8\ub2e4. \uc9c0\uc5ed\ubcc4\ub85c\ub294 \uc544\uc2dc\uc544 \ud0dc\ud3c9\uc591 \uc9c0\uc5ed\uc774 \uac00\uc7a5 \ub192\uc740 CAGR\uc744 \ubcf4\uc774\uba70 \ube60\ub974\uac8c \uc131\uc7a5\ud560 \uac83\uc73c\ub85c \uc608\uc0c1\ub418\uba70, 2025\ub144\uc5d0\ub294 \ubd81\ubbf8 \uc9c0\uc5ed\uc774 \uac00\uc7a5 \ud070 \uc2dc\uc7a5 \uc810\uc720\uc728\uc744 \ucc28\uc9c0\ud560 \uac83\uc73c\ub85c \ubd84\uc11d\ub429\ub2c8\ub2e4. \ubcf8 \ubcf4\uace0\uc11c\ub294 2019\ub144\ubd80\ud130 2024\ub144\uae4c\uc9c0\uc758 \uacfc\uac70 \uc2dc\uc7a5 \uaddc\ubaa8 \ub370\uc774\ud130\uc640 2025\ub144\ubd80\ud130 2030\ub144\uae4c\uc9c0\uc758 \uc2dc\uc7a5 \uaddc\ubaa8 \uc608\uce21\uc744 \ud3ec\ud568\ud558\uc5ec \ud3ec\uad04\uc801\uc778 \uc2dc\uac04 \ubc94\uc704\ub97c \uc81c\uacf5\ud569\ub2c8\ub2e4.<\/p>\n<p>\uc774 \ubcf4\uace0\uc11c\ub294 \uace0\ubc00\ub3c4 \ud328\ud0a4\uc9d5 \uc2dc\uc7a5\uc758 \ud604\uc7ac \uaddc\ubaa8, \uc8fc\uc694 \ud50c\ub808\uc774\uc5b4, \uac00\uc7a5 \ube60\ub974\uac8c \uc131\uc7a5\ud558\ub294 \uc9c0\uc5ed, \uac00\uc7a5 \ud070 \uc2dc\uc7a5 \uc810\uc720\uc728\uc744 \uac00\uc9c4 \uc9c0\uc5ed \ub4f1 \ud575\uc2ec \uc9c8\ubb38\uc5d0 \ub300\ud55c \ub2f5\ubcc0\uc744 \uc81c\uacf5\ud558\uc5ec \uc2dc\uc7a5 \ucc38\uc5ec\uc790\ub4e4\uc774 \uc804\ub7b5\uc801 \uc758\uc0ac\uacb0\uc815\uc744 \ub0b4\ub9ac\ub294 \ub370 \ud544\uc218\uc801\uc778 \uc815\ubcf4\ub97c \uc81c\uacf5\ud569\ub2c8\ub2e4.<\/p>\n","protected":false},"author":1,"featured_media":0,"comment_status":"closed","ping_status":"","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[1],"tags":[],"class_list":["post-40112","post","type-post","status-publish","format-standard","hentry","category-market-reports"],"_links":{"self":[{"href":"https:\/\/www.globalresearch.co.kr\/insight\/wp-json\/wp\/v2\/posts\/40112"}],"collection":[{"href":"https:\/\/www.globalresearch.co.kr\/insight\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.globalresearch.co.kr\/insight\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.globalresearch.co.kr\/insight\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.globalresearch.co.kr\/insight\/wp-json\/wp\/v2\/comments?post=40112"}],"version-history":[{"count":0,"href":"https:\/\/www.globalresearch.co.kr\/insight\/wp-json\/wp\/v2\/posts\/40112\/revisions"}],"wp:attachment":[{"href":"https:\/\/www.globalresearch.co.kr\/insight\/wp-json\/wp\/v2\/media?parent=40112"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.globalresearch.co.kr\/insight\/wp-json\/wp\/v2\/categories?post=40112"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.globalresearch.co.kr\/insight\/wp-json\/wp\/v2\/tags?post=40112"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}