세계의 와이드 밴드갭 (WBG) 반도체 시장 (2023년-2032년) : 재료별 (탄화 규소 (SiC), 질화 갈륨 (GaN), 다이아몬드, 기타), 산업별 (가전, 자동차, 항공 우주 및 방위, IT 및 통신, 에너지 및 유틸리티, 기타)

CHAPTER 1: INTRODUCTION
1.1. Report description
1.2. Key market segments
1.3. Key benefits to the stakeholders
1.4. Research methodology
1.4.1. Primary research
1.4.2. Secondary research
1.4.3. Analyst tools and models
CHAPTER 2: EXECUTIVE SUMMARY
2.1. CXO Perspective
CHAPTER 3: MARKET OVERVIEW
3.1. Market definition and scope
3.2. Key findings
3.2.1. Top impacting factors
3.2.2. Top investment pockets
3.3. Porter’s five forces analysis
3.3.1. High bargaining power of suppliers
3.3.2. Moderate threat of new entrants
3.3.3. Low to moderate threat of substitutes
3.3.4. Moderate to high intensity of rivalry
3.3.5. Moderate to high bargaining power of buyers
3.4. Market dynamics
3.4.1. Drivers
3.4.1.1. Growing investments in R&D activities for wide bandgap materials
3.4.1.2. Surge in demand for EVs driving global wide band gap semiconductors market
3.4.2. Restraints
3.4.2.1. High cost of wide bandgap semiconductor
3.4.3. Opportunities
3.4.3.1. Growing demand for wide bandgap devices in electric vehicles
CHAPTER 4: WIDE BANDGAP SEMICONDUCTORS MARKET, BY MATERIAL
4.1. Overview
4.1.1. Market size and forecast
4.2. Silicon Carbide (SiC)
4.2.1. Key market trends, growth factors and opportunities
4.2.2. Market size and forecast, by region
4.2.3. Market share analysis by country
4.3. Gallium Nitride (GaN)
4.3.1. Key market trends, growth factors and opportunities
4.3.2. Market size and forecast, by region
4.3.3. Market share analysis by country
4.4. Diamond
4.4.1. Key market trends, growth factors and opportunities
4.4.2. Market size and forecast, by region
4.4.3. Market share analysis by country
4.5. Others
4.5.1. Key market trends, growth factors and opportunities
4.5.2. Market size and forecast, by region
4.5.3. Market share analysis by country
CHAPTER 5: WIDE BANDGAP SEMICONDUCTORS MARKET, BY INDUSTRY VERTICAL
5.1. Overview
5.1.1. Market size and forecast
5.2. Consumer Electronics
5.2.1. Key market trends, growth factors and opportunities
5.2.2. Market size and forecast, by region
5.2.3. Market share analysis by country
5.3. Automotive
5.3.1. Key market trends, growth factors and opportunities
5.3.2. Market size and forecast, by region
5.3.3. Market share analysis by country
5.4. Aerospace and Defense
5.4.1. Key market trends, growth factors and opportunities
5.4.2. Market size and forecast, by region
5.4.3. Market share analysis by country
5.5. IT and Telecom
5.5.1. Key market trends, growth factors and opportunities
5.5.2. Market size and forecast, by region
5.5.3. Market share analysis by country
5.6. Energy and Utility
5.6.1. Key market trends, growth factors and opportunities
5.6.2. Market size and forecast, by region
5.6.3. Market share analysis by country
5.7. Others
5.7.1. Key market trends, growth factors and opportunities
5.7.2. Market size and forecast, by region
5.7.3. Market share analysis by country
CHAPTER 6: WIDE BANDGAP SEMICONDUCTORS MARKET, BY REGION
6.1. Overview
6.1.1. Market size and forecast By Region
6.2. North America
6.2.1. Key market trends, growth factors and opportunities
6.2.2. Market size and forecast, by Material
6.2.3. Market size and forecast, by Industry Vertical
6.2.4. Market size and forecast, by country
6.2.4.1. U.S.
6.2.4.1.1. Market size and forecast, by Material
6.2.4.1.2. Market size and forecast, by Industry Vertical
6.2.4.2. Canada
6.2.4.2.1. Market size and forecast, by Material
6.2.4.2.2. Market size and forecast, by Industry Vertical
6.2.4.3. Mexico
6.2.4.3.1. Market size and forecast, by Material
6.2.4.3.2. Market size and forecast, by Industry Vertical
6.3. Asia-Pacific
6.3.1. Key market trends, growth factors and opportunities
6.3.2. Market size and forecast, by Material
6.3.3. Market size and forecast, by Industry Vertical
6.3.4. Market size and forecast, by country
6.3.4.1. China
6.3.4.1.1. Market size and forecast, by Material
6.3.4.1.2. Market size and forecast, by Industry Vertical
6.3.4.2. Japan
6.3.4.2.1. Market size and forecast, by Material
6.3.4.2.2. Market size and forecast, by Industry Vertical
6.3.4.3. India
6.3.4.3.1. Market size and forecast, by Material
6.3.4.3.2. Market size and forecast, by Industry Vertical
6.3.4.4. South Korea
6.3.4.4.1. Market size and forecast, by Material
6.3.4.4.2. Market size and forecast, by Industry Vertical
6.3.4.5. Rest of Asia-Pacific
6.3.4.5.1. Market size and forecast, by Material
6.3.4.5.2. Market size and forecast, by Industry Vertical
6.4. Europe
6.4.1. Key market trends, growth factors and opportunities
6.4.2. Market size and forecast, by Material
6.4.3. Market size and forecast, by Industry Vertical
6.4.4. Market size and forecast, by country
6.4.4.1. UK
6.4.4.1.1. Market size and forecast, by Material
6.4.4.1.2. Market size and forecast, by Industry Vertical
6.4.4.2. Germany
6.4.4.2.1. Market size and forecast, by Material
6.4.4.2.2. Market size and forecast, by Industry Vertical
6.4.4.3. France
6.4.4.3.1. Market size and forecast, by Material
6.4.4.3.2. Market size and forecast, by Industry Vertical
6.4.4.4. Rest of Europe
6.4.4.4.1. Market size and forecast, by Material
6.4.4.4.2. Market size and forecast, by Industry Vertical
6.5. LAMEA
6.5.1. Key market trends, growth factors and opportunities
6.5.2. Market size and forecast, by Material
6.5.3. Market size and forecast, by Industry Vertical
6.5.4. Market size and forecast, by country
6.5.4.1. Latin America
6.5.4.1.1. Market size and forecast, by Material
6.5.4.1.2. Market size and forecast, by Industry Vertical
6.5.4.2. Middle East
6.5.4.2.1. Market size and forecast, by Material
6.5.4.2.2. Market size and forecast, by Industry Vertical
6.5.4.3. Africa
6.5.4.3.1. Market size and forecast, by Material
6.5.4.3.2. Market size and forecast, by Industry Vertical
CHAPTER 7: COMPETITIVE LANDSCAPE
7.1. Introduction
7.2. Top winning strategies
7.3. Product mapping of top 10 player
7.4. Competitive dashboard
7.5. Competitive heatmap
7.6. Top player positioning, 2022
CHAPTER 8: COMPANY PROFILES
8.1. Infineon Technologies AG
8.1.1. Company overview
8.1.2. Key executives
8.1.3. Company snapshot
8.1.4. Operating business segments
8.1.5. Product portfolio
8.1.6. Business performance
8.1.7. Key strategic moves and developments
8.2. Microsemi Corporation.
8.2.1. Company overview
8.2.2. Key executives
8.2.3. Company snapshot
8.2.4. Operating business segments
8.2.5. Product portfolio
8.2.6. Business performance
8.3. STMicroelectronics
8.3.1. Company overview
8.3.2. Key executives
8.3.3. Company snapshot
8.3.4. Operating business segments
8.3.5. Product portfolio
8.3.6. Business performance
8.3.7. Key strategic moves and developments
8.4. ROHM Semiconductor
8.4.1. Company overview
8.4.2. Key executives
8.4.3. Company snapshot
8.4.4. Operating business segments
8.4.5. Product portfolio
8.4.6. Business performance
8.4.7. Key strategic moves and developments
8.5. Texas Instruments Inc.
8.5.1. Company overview
8.5.2. Key executives
8.5.3. Company snapshot
8.5.4. Operating business segments
8.5.5. Product portfolio
8.5.6. Business performance
8.5.7. Key strategic moves and developments
8.6. Vishay Intertechnology Inc.
8.6.1. Company overview
8.6.2. Key executives
8.6.3. Company snapshot
8.6.4. Operating business segments
8.6.5. Product portfolio
8.6.6. Business performance
8.7. Genesic Semiconductor
8.7.1. Company overview
8.7.2. Key executives
8.7.3. Company snapshot
8.7.4. Operating business segments
8.7.5. Product portfolio
8.8. Panasonic Corporation
8.8.1. Company overview
8.8.2. Key executives
8.8.3. Company snapshot
8.8.4. Operating business segments
8.8.5. Product portfolio
8.8.6. Business performance
8.9. Nexperia
8.9.1. Company overview
8.9.2. Key executives
8.9.3. Company snapshot
8.9.4. Operating business segments
8.9.5. Product portfolio
8.9.6. Key strategic moves and developments
8.10. Wolfspeed, Inc.
8.10.1. Company overview
8.10.2. Key executives
8.10.3. Company snapshot
8.10.4. Operating business segments
8.10.5. Product portfolio
8.10.6. Business performance
8.10.7. Key strategic moves and developments